Apparatus, method, and system for detecting acceleration and motor monitoring

ABSTRACT

Described is a system which includes: a cable including: a first fiber optic interconnect to provide an input light; and a second fiber optic interconnect to provide an output light; and a first housing coupled to the cable, the first housing including: a first deflection circuit to deflect the input light received from the first fiber optic interconnect in response to a vibration or movement of the first housing; and a second housing coupled to the cable, the second housing including: a light source to generate the input light for transmission to the first deflection circuit via the first fiber optic interconnect; and a photo detector to receive the output light from the first deflection circuit via the second fiber optic interconnect.

BACKGROUND

Accelerometers are used in industrial environments for measuringvibrations of equipment and building structures. Accelerometers can beused to predict failure of the equipment or to find whether operationconditions are outside the prescribed limits. Semiconductor fabricationfactories may have many thousands of these accelerometers to monitorvibrations in factories and its equipment.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments of the disclosure will be understood more fully from thedetailed description given below and from the accompanying drawings ofvarious embodiments of the disclosure, which, however, should not betaken to limit the disclosure to the specific embodiments, but are forexplanation and understanding only.

FIG. 1 illustrates a system with a vibrating module having one or moreaccelerometers coupled to a processing module, according to someembodiments of the disclosure.

FIG. 2 illustrates a system with one or more accelerometers on a motor(e.g., electric motor) coupled to a processing module via a cable havingfiber optic interconnects and/or other wires, according to someembodiments of the disclosure.

FIG. 3 illustrates a cross section of the cable carrying fiber opticinterconnects and copper wires for coupling the vibrating module withthe processing module, according to some embodiments of the disclosure.

FIG. 4 illustrates a flowchart of a method performed by the vibratingmodule, according to some embodiments of the disclosure.

FIG. 5 illustrates a flowchart of a method performed by a processingapparatus, according to some embodiments of the disclosure.

FIG. 6 illustrates a computer system or a SoC (System-on-Chip) withapparatus to measure vibration of one or more vibration modules and/orrotation rate of a shaft, according to some embodiments.

DETAILED DESCRIPTION

Traditional deflection modules use Integrated Electronic Piezoelectric(IEPE) accelerometers which are a class of piezoelectric accelerometersthat incorporate an electronic amplifier and use a single two-polecoaxial connector for both power input and signal output. The IEPEinterface is defined in the Institute of Electrical and ElectronicsEngineers (IEEE) 1451.4 standard. In a traditional deflection module,power is supplied to an inner conductor of a coaxial cable from anexternal constant-current supply (e.g., 0.5 mA to 8 mA). The outputsignal from the traditional deflection module is also on the innerconductor, and consists of an Alternating Current (AC) voltage centeredon a bias voltage (e.g., a bias voltage of about 8V to 12V). The outputvoltage is bounded at the lower end by the saturation voltage of theintegrated IEPE amplifier (e.g., 0.5V to 2V), and at the upper end bythe maximum compliance voltage of the current source (which may beanything between about 6V and 30V). High voltage appearing on avibrating module (e.g., motor chassis) can couple to the output signaland may distort the acceleration data.

The existing industrial accelerometers are expensive (e.g., $150 to $400per accelerometer), measure only a single axis (i.e., requiring multipleaccelerometers per motor), require an expensive analog input/output(I/O) circuit board to digitize the analog output from theaccelerometers, and use expensive coaxial cable to connect theaccelerometers to the I/O circuit board. The existing accelerometer alsohas to be electrically isolated so that a high voltage appearing on thevibrating equipment (e.g., motor chassis) does not couple into the I/Oboard. With multiple accelerometers, the multichannel acquisition board,cables, and the hardware become expensive (e.g., around $1000 to $1500per motor).

The existing accelerometers also degrade due to crystal defects and someaccelerometers must be replaced regularly (e.g., every 3 to 5 years). Insuch cases, additional circuitry may be needed to detect when theaccelerometers must be replaced. The existing accelerometers have ananalog output. Analog signals are prone to noise from various sources.There is no room inside the existing accelerometers to includedigitization circuits to convert these analog outputs to digitalrepresentations. Making the accelerometers bigger is not an option dueto the increased mass that would impact the accuracy. The analog signalshave to be sent over long distances (e.g., greater than 10 meters) andthe signals may be very small (e.g., the signal may need to measure downto 1 mV). Electrical noise is a significant limitation on the accuracyof current systems. Such and other limitations are resolved by variousembodiments described here.

Some embodiments are generally directed to lower-cost industrialaccelerometers that allow them to be economically feasible to monitormore vibrating modules (e.g., motors). In some embodiments, a deflectioncircuit or module is used for a vibrating module to determineacceleration in the vibrating module. In some embodiments, thedeflection circuit deflects an input light beam (e.g., a laser beam, ora Light Emitting Diode (LED) beam) such that the deflection of thelight, which is received as output of the deflection circuit, isproportional to the acceleration associated with the vibrating module.In some embodiments, the deflection of the light is measured by a photodetection circuit.

In some embodiments, a system is provided which comprises a cable thatincludes a first fiber optic interconnect to provide an input light; anda second fiber optic interconnect to provide an output light. In someembodiments, the system includes a first housing coupled to one end ofthe cable. The first housing is also referred to as the first vibratingmodule. In some embodiments, the first housing comprises a firstdeflection module to deflect the input light received from the firstfiber optic interconnect in response to a vibration or movement of thefirst housing.

In some embodiments, the system includes a second housing coupled to theother end of the cable, such that the second housing comprises a lightsource to generate the input light for transmission to the firstdeflection module via the first fiber optic interconnect. In someembodiments, the second housing also comprises a photo detector toreceive the output light from the first deflection module via the secondfiber optic interconnect. In some embodiments, a motor (e.g., anelectric motor) is part of the first housing.

In some embodiments, the motor includes a shaft which is operable torotate. In some embodiments, the shaft has a reflective section thatreflects off light when light falls on the reflective section of theshaft. In some embodiments, the first housing includes a light source toshine light on the shaft; and a photo detector to detect light reflectedoff the reflective section. In some embodiments, the cable includes agroup of interconnects or wires to provide power to the light source ofthe first housing and to carry an output of the photo-detector. In someembodiments, the light source and photo detector used for measuring therotation of the shaft are positioned outside the first housing. In someembodiments, the second housing includes a tachometer to receive theoutput of the photo detector of the first housing. In some embodiments,the second housing includes a processing module to process the deflectedlight to determine acceleration associated with the vibrating module. Insome embodiments, the processing module also determines a rate ofrotation of the shaft according to the output of the photo-detector.

In some embodiments, the second housing may have multiple light sourcetransmitters and photo-detectors to detect and process deflected lightsfrom a number of deflection modules that may be placed on multiplehousings (e.g., multiple motors) or multiple places on the same housing(e.g., to measure multi-dimensional acceleration of an electric motor).The accelerometer system of some embodiments also includes a tachometerto determine the rate of rotation of a rotating shaft in the firsthousing (or the vibrating module).

There are many technical effects of the various embodiments. Forexample, the accelerometer system of various embodiments significantlylowers cost (e.g., by half) than existing accelerometers (i.e.,piezoelectric accelerometers). The accelerometer system of variousembodiments significantly lowers installation labor costs compared tothe existing accelerometer systems because there are fewer cables toinstall. The accelerometer system of various embodiments provides betteraccuracy than the existing accelerometer systems because there is noneed to send analog signals over long distances from the vibratingmodule to a processing module.

The accelerometer system of various embodiments also exhibits betterelectrical isolation because fiber optic interconnects are inherentlynon-conductive and so when they are coupled to the deflection circuit,electrical noise is not transferred over to the fiber opticinterconnects. The accelerometer system of various embodiments alsoplaces the processing module away from the vibrating module to isolateharsh conditions and environment of the vibrating module from theprocessing module. Other technical effects will be evident from thevarious embodiments described here.

In the following description, numerous details are discussed to providea more thorough explanation of embodiments of the present disclosure. Itwill be apparent, however, to one skilled in the art, that embodimentsof the present disclosure may be practiced without these specificdetails. In other instances, well-known structures and devices are shownin block diagram form, rather than in detail, in order to avoidobscuring embodiments of the present disclosure.

Note that in the corresponding drawings of the embodiments, signals arerepresented with lines. Some lines may be thicker, to indicate moreconstituent signal paths, and/or have arrows at one or more ends, toindicate primary information flow direction. Such indications are notintended to be limiting. Rather, the lines are used in connection withone or more exemplary embodiments to facilitate easier understanding ofa circuit or a logical unit. Any represented signal, as dictated bydesign needs or preferences, may actually comprise one or more signalsthat may travel in either direction and may be implemented with anysuitable type of signal scheme.

Throughout the specification, and in the claims, the term “connected”means a direct electrical, optical, or wireless connection between thethings that are connected, without any intermediary devices. The term“coupled” means either a direct electrical, optical, or wirelessconnection between the things that are connected or an indirectconnection through one or more passive or active intermediary devices.The term “circuit” or “module” may refer to one or more passive and/oractive components that are arranged to cooperate with one another toprovide a desired function. The term “signal” may refer to at least onelight signal, radio frequency (RF) signal, electromagnetic signal,current signal, voltage signal or data/clock signal, etc. The meaning of“a,” “an,” and “the” include plural references. The meaning of “in”includes “in” and “on.”

The terms “substantially,” “close,” “approximately,” “near,” and“about,” generally refer to being within +/−20% of a target value.Unless otherwise specified the use of the ordinal adjectives “first,”“second,” and “third,” etc., to describe a common object, merelyindicate that different instances of like objects are being referred to,and are not intended to imply that the objects so described must be in agiven sequence, either temporally, spatially, in ranking or in any othermanner.

For purposes of the embodiments, the transistors in various circuits,modules, and logic blocks are metal oxide semiconductor (MOS)transistors, which include drain, source, gate, and bulk terminals. Thetransistors also include Tri-Gate and FinFET transistors, Gate AllAround Cylindrical Transistors, Tunneling FET (TFET), Square Wire, orRectangular Ribbon Transistors or other devices implementing transistorfunctionality like carbon nano tubes or spintronic devices. MOSFETsymmetrical source and drain terminals i.e., are identical terminals andare interchangeably used here. A TFET device, on the other hand, hasasymmetric Source and Drain terminals. Those skilled in the art willappreciate that other transistors, for example, Bi-polar junctiontransistors—BJT PNP/NPN, BiCMOS, CMOS, eFET, etc., may be used withoutdeparting from the scope of the disclosure.

FIG. 1 illustrates system 100 with a vibrating module having one or moreaccelerometers coupled to a processing module, according to someembodiments of the disclosure. In some embodiments, system 100 comprisesa processing housing 101 (also referred to as the second housing), oneor more vibrating modules 102-1 to 102-N (also referred to as the firsthousing), where ‘N’ is an integer; and one or more cables 105 forcoupling the processing housing 101 with the one or more vibratingmodules 102-1 to 102-N.

In some embodiments, processing housing 101 includes light sources,voltage source(s), and detectors (e.g., photo detectors) 106 andProcessing Module 107 to process data received from a communication busand/or light sources and detectors (e.g., photo detectors) 106. In someembodiments, processing housing 101 is a protective covering to protecta Printed Circuit Board (PCB) having light sources and detectors 106,Processing Module 107, and other circuits/modules.

In some embodiments, Processing Module 107 controls the intensity and/orwavelength of the light source (e.g., a laser or Light Emitting Diode).In some embodiments, Processing Module 107 receives output of photodetectors and processes that output to determine the accelerationassociated with the vibrating module (e.g., 102-1 through 102-N). Insome embodiments, Processing Module 107 can be controlled by machineexecutable instructions received via antenna 108 and/or thecommunication bus. One embodiment of Processing Module 107 is describedwith reference to FIG. 6.

Referring back to FIG. 1, in some embodiments, one or more cables 105(e.g., 101-1 to 101-N) are coupled at one end to processing housing 101and at another end to one or more Vibrating modules (e.g., 101-1 to101-N), where ‘N’ is an integer. In some embodiments, Vibrating Modulesinclude one or more deflection modules and/or one or more circuits fordetecting reflected light off a rotating shaft in the Vibrating Modules.For example, Vibrating Module 102-1 includes deflection modules 103-1through 103-N and/or a circuit 104 for detecting reflected light off arotating shaft. In another example, Vibrating Module 102-N includes asingle deflection module 102 and/or a circuit 104 for detectingreflected light off a rotating shaft. In some embodiments, circuit 104for detecting reflected light off a rotating shaft in the vibratingmodule may not be included in the vibrating module. For example, circuit104 may be separate from the vibrating module. In some embodiments,voltage source(s) in 106 may be used to provide power/ground supplies tocircuit 104.

In some embodiments, cables 105 include multiple fiber opticinterconnects for sending and receiving light to and from one or moredeflection modules in the one or more Vibrating Modules (102-1 through102-N). In some embodiments, cables 105 also include metal interconnects(e.g., Cu interconnects) for providing power and ground supplies, andsignal path(s) for other circuits in the one or more Vibrating Modules.

For example, in some embodiments, Vibrating Modules may have circuits toflash light on a rotating shaft and to detect light reflection off theshaft. In this example, power and ground supplies are provided to thelight source and/or photo detectors, and signal path is provided to sendan output of photo detectors to processing housing 101. In someembodiments, circuit 104 is separate from Vibrating Module 102-1. Forexample, the power/ground supplies and signal wire(s) may be bundledwith fiber optic interconnects in the same cable 105, but the lightsource for illuminating the shaft and the associated photo detector ofcircuit 104 are separate from Vibrating Module 102-1.

FIG. 2 illustrates system 200 with one or more accelerometers on a motor(e.g., electric motor) coupled to a processing module via a cable havingfiber optic interconnects, according to some embodiments of thedisclosure. It is pointed out that those elements of FIG. 2 having thesame reference numbers (or names) as the elements of any other figurecan operate or function in any manner similar to that described, but arenot limited to such.

In some examples, a vibrating module may have a motor as the vibratingsource. While various embodiments are described with reference to anelectric motor being a vibrating source, other vibrating sources mayalso be used in the Vibrating modules. For example, gas powered engines,generators, turbines, semiconductor fabrication equipment, sections of abuilding, and other machines may be used as a vibrating source. In thisexample, Vibrating Module 102-1 is described. Similar description isapplicable to other Vibrating modules.

In some embodiments, Vibrating Module 102-1 includes Motor 201 (e.g.,electric motor, gas powered motor, etc.), motor shaft 202, deflectionmodules 103-1 and 103-2 (collectively referred to here by identifier103), interface to cable 105-1, fiber optic interconnects 203-1, 204-1,203-2, and 204-2; and ground/power/signal lines 205-1. In thisembodiment, two deflection modules 103-1 and 103-2 are shown positionedin different orientations to detect acceleration in different axis. Forexample, deflection module 103-1 may provide acceleration data along ay-axis while module 103-2 may provide acceleration data along an x-axis.

In some embodiments, deflection modules 103 have a higher frequencyresponse (e.g., up to 30 KHz) and can be used to measure largevibrations (e.g., up to 80G's), and are durable. In some embodiments,the deflected light is captured and then processed by processing housing101 to determine the rate of acceleration. In some embodiments,processing housing 101 provides real-time acceleration information. Forexample, processing housing 101 detects deflected light during vibrationand provides acceleration information associated with the deflectedlight. The amount of deflection in the light is proportional to theacceleration.

As mentioned earlier, high voltage may appear on a vibrating module(e.g., motor chassis) which can couple to the output signal and maydistort the acceleration data. To solve that problem, in someembodiments, deflection modules 103 use fiber optics for sending lightand receiving deflected light to determine acceleration of the VibratingModule without concern of the high voltage appearing on the VibratingModule coupling to the fiber optic (because the fiber optic cables areinherently non-conductive).

In some embodiments, deflection module 103-1 receives an input lightfrom fiber optic interconnect 203-1 and provides any deflected light (oroutput light) to fiber optic interconnect 204-1. In some embodiments,deflection module 103-2 receives an input light from fiber opticinterconnect 203-2 and provides any deflected light (or output light) tofiber optic interconnect 204-2. While this embodiment shows twodeflection modules, any number of deflection modules may be used in anylocation and orientation to generate multi-dimensional accelerationdata.

In some embodiments, cable 105-1 also carries metal wires (e.g., Cuwires) to provide power and ground supplies, and signal return path tocircuit 104. In some embodiments, circuit 104 comprises a LED or anyother light source which is powered by power/ground supplies ininterconnect bundle 205-1. In some embodiments, power and groundsupplies are not carried by cable 105-1 and instead, local power/groundsupplies (i.e., local to Vibrating Module 102-1) are used for circuit104. In some embodiments, circuit 104 also comprises a photo detector todetect light reflected off a reflection tape on shaft 202.

For example, when shaft 202 rotates and light is focused on shaft 202,then whenever the reflection tape on shaft 202 receives the focusedlight, it reflects that light back to circuit 104. A photo detector incircuit 104 then converts the received light from shaft 202 to anelectrical signal which is carried by the signal path (i.e., one ofinterconnects 205-1) to cable 105-1 and then to processing housing 101.In some embodiments, circuit 104 is separate from Vibrating Module102-1. For example, circuit 104 may be positioned outside of VibratingModule 102-1.

In some embodiments, processing housing 101 comprises one or more LightSources 206-1 through 206-N, where ‘N’ is an integer. In someembodiments, Light Sources (generally referred to here by identifier206) may be implemented as LEDs, lasers, etc. In some embodiments,Processing Module 107 controls various aspects of Light Sources 206. Forexample, Processing Module 107 may turn on/off a Light Source 206,change the intensity of light generated by Light Source 206, change thewavelength of the light generated by Light Source 206, etc.

In some embodiments, the output of Light Source 206 is transmitted to adeflection module via a fiber optic interconnect. For example, fiberoptic interconnect 203-1 carries the light to deflection module 103-1,and fiber optic interconnect 203-2 carries the light to deflectionmodule 103-2. In some embodiments, the output of Light Source 206 mayalso be received by other deflection modules in other Vibrating Modules.For example, fiber optic interconnect 203-N carries light to deflectionmodule 103-N in Vibrating Module 102-N.

In some embodiments, processing housing 101 comprises one or more PhotoDetectors 207-1 through 207-N, where ‘N’ is an integer. In someembodiments, Photo Detectors (generally referred to here as identifier207) may be implemented as photodiodes that receive light and generatean electrical signal (i.e., voltage/current) in response to an incidentlight. In some embodiments, Processing Module 107 controls variousaspects of Photo Detector 207. For example, Processing Module 107 mayturn on/off Photo Detector 207, change the amplification of theelectrical signal generated by Photo Detector 207, etc.

In some embodiments, the output of deflection module(s) is received byPhoto Detector 207 via a fiber optic interconnect. For example, fiberoptic interconnect 204-1 carries light from deflection module 103-1 toPhoto Detector 207-1, and fiber optic interconnect 204-2 carries lightfrom deflection module 103-2 to Photo Detector 207-2. In someembodiments, the output of deflection modules in other Vibrating Modulesmay also be received by Photo Detector 207. For example, fiber opticinterconnect 204-N carries light from deflection module 103-N positionedin Vibrating Module 102-N.

In some embodiments, the output(s) of Photo Detectors 207 is received byProcessing Module 107 which processes the data to determine theacceleration associated with different deflection modules. In someembodiments, Processing Module 107 includes an Analog-to-Digital (A2D)converter to convert an analog output of Photo Detectors 207 to adigital representation of those analog signals. In some embodiments, thedigital representation may be a stream of ones and zeros indicating thedeflection of light, and hence the rate of acceleration associated withthe deflection module. As the sequence of ones and zeros change, due tovibration in the Vibrating Module (which causes deflection module todeflect input light differently before and after the vibration),acceleration is determined.

In some embodiments, as the deflecting element in the deflectionmodule(s) 203 moves, the amplitude of the light output from thedeflection module(s) changes. In some embodiments, the deflectingelement is set up such that the amplitude of the light received by thedeflection module(s) 203 is proportional to the acceleration.

For example, at a neutral position (e.g., when there is no movement) ofthe deflection module(s) 203, 50% of the input light may be deflected.When the acceleration is in one direction (such as “up”), the deflectionelement moves such as to allow more of the light to pass through. At themaximum allowed upward acceleration, up to 100% of the light may passthrough the deflection module(s) 203. When the acceleration is in theopposite direction (such as “down”), the deflection element lets less ofthe light to pass through the deflection module(s) 203. At the maximumallowed downward acceleration, as little as 0% of the light may passthrough. In some embodiments, the mounting of the deflection element issuch that a change in the amount of input light passing through thedeflection module(s) 203 is proportional to the acceleration.

In some embodiments, processing housing 101 includes one or moreTachometers 209-1 through 209-N, where ‘N’ is an integer. Tachometer(generally referred to here by identifier 209) is an instrumentmeasuring the rotation speed (or rate of rotation) of shaft 202 in Motor201 or other machines. In some embodiments, Tachometer 209 receives asignal on conductive wire 205-1 which is the output of a photo detectorin circuit 104.

In some embodiments, first housing 101 includes Filter 214 to filter theoutput of Tachometer 209. The filtered output 212 is then provided toCommunication (Comm.) Interface 210 via bus 212 and/or to ProcessingModule 107 via bus 213 for further processing. In some embodiments,Processing Module 107 processes the data on bus 213 (e.g., it filtersthe data and converts it into a signal format for transmission byAntenna 108 or by Comm. Interface 210).

For example, Processing Module 107 receives output 213 (which in someembodiments is filtered by Filter 214) and generates a packet of datathat includes samples from A2D 208 and data from Tachometer 209, andsends that packet to another device via using antenna 108. In someembodiments, another conductive wire (e.g., 205-N) is used to providesignal to Tachometer 209 from another photo detector (e.g., of circuitin Vibrating Module 101-N).

In some embodiments, all interconnects from first housing 101 toVibrating module(s) are provided by a single cable bundle 105. Forexample, cable bundle 105 at one end has an interface for first housing101 and at another end has multiple interfaces for multiple VibratingModules. In this example, wires 105-1 through 105-N are bundled togethersingle cable 105. In some embodiments, first housing 101 has multipleinterfaces to interface with multiple cables 105-1 through 105-N (asshown) such that each cable is dedicated for a Vibrating Module. Forexample, cable 105-1 is for Vibrating Module 102-1; cable 105-N is forVibrating Module 102-N, etc.

In some embodiments, Comm. Interface 210 is used to provide an externalaccess to processing housing 101. For example, Comm. Interface 210 mayinterface with Processing Module 107 via bus 211. In some embodiments,data is sent via Comm. Interface 210 to another system (such as aserver) that may provide a human user interface through web services. Insome embodiments, Comm. Interface 210 may provide a variety of standardand/or proprietary I/O interfaces. For example, Comm. Interface 210 mayprovide interfaces for Ethernet, Universal Serial Bus (USB),Thunderbolt®, etc. In some embodiments, antenna 108 may also be used tocommunicate with any device in processing housing 101.

In some embodiments, antennas 108 may comprise one or more directionalor omnidirectional antennas, including monopole antennas, dipoleantennas, loop antennas, patch antennas, microstrip antennas, coplanarwave antennas, or other types of antennas suitable for transmission ofRadio Frequency (RF) signals. In some multiple-input multiple-output(MIMO) embodiments, antennas 108 are separated to take advantage ofspatial diversity. In some embodiments, processing housing 101 includescommunication circuits to generate wireless signals that comply with oneor more standards. For example, communication circuits may allow sendingand receiving of Wi-Fi signals, Bluetooth® signals, 3G/4G signals, LongTerm Evolution (LTE) compliant signals, etc. over antenna 108 to otherdevices.

FIG. 3 illustrates cross section 300 of the cable (e.g., 105-1) carryingfiber optic interconnects and copper wires for coupling the vibratingmodule with the processing module, according to some embodiments of thedisclosure. It is pointed out that those elements of FIG. 3 having thesame reference numbers (or names) as the elements of any other figurecan operate or function in any manner similar to that described, but arenot limited to such.

Cross section 300 shows cable cover 105-1. The cable cover 105-1 may beformed of any flexible and durable material. In some embodiments, cable105-1 carries one or more pairs of fiber optic interconnects. In thisexample, Cable 105-1 includes fiber optic interconnects 203-1, 204-1,203-2, 204-2, bundle of metal interconnects 205-1 having wire(s) 301 tocarry power, wire(s) 302 to carry ground, and wire(s) 303 to carrysignal from photo detector of circuit 104. In some embodiments, otherwires for other circuits may also be bundled within cable 105-1.

FIG. 4 illustrates flowchart 400 of a method performed by the vibratingmodule, according to some embodiments of the disclosure. It is pointedout that those elements of FIG. 4 having the same reference numbers (ornames) as the elements of any other figure can operate or function inany manner similar to that described, but are not limited to such.

Although the blocks in flowchart 400 with reference to FIG. 4 are shownin a particular order, the order of the actions can be modified. Thus,the illustrated embodiments can be performed in a different order, andsome actions/blocks may be performed in parallel. Some of the blocksand/or operations listed in FIG. 4 are optional in accordance withcertain embodiments. The numbering of the blocks presented is for thesake of clarity and is not intended to prescribe an order of operationsin which the various blocks must occur. Additionally, operations fromthe various flows may be utilized in a variety of combinations.

At block 401, input light is received by deflection module 103-1 fromfirst fiber optic interconnect 203-1 of cable 105-1. In someembodiments, the input light is generated by Light Source 206-1 (e.g.,laser, LED, etc.). At block 402, deflection module 103-1 deflects theinput light in response to vibration or movement of Vibration Module102-1 (or vibration apparatus). At block 403, an output light fromdeflection module 103-1 is provided to second fiber optic interconnect204-1 of cable 105-1.

In some embodiments, the output light is detected by Photo Detector207-1 which converts the output light to an analog electrical signal. Insome embodiments, A2D converter 208 converts the analog electricalsignal to a digital representation and acceleration of Vibrating Module102-1 is determined with reference to deflection module 103-1. Thisacceleration information can be provided to another device using theComm. Interface 210 or via antenna 108.

At block 404, power/ground supplies are provided to a light source(e.g., LED) of circuit 104. This light source is positioned towardsshaft 202 which has a reflective tape on a section of shaft 202. Asshaft 202 rotates, every time light falls on the reflective tape, it isreflected back to circuit 104. While flowchart 400 shows blocks 403 and404 to be in a sequence, blocks 403 and 404 may be performed in parallelaccording to some embodiments.

At block 405, the reflected light is detected by a photo detector ofcircuit 104 which may also be powered by the power supply provided byinterconnect bundle 205-1. At block 406, the photo detector of circuit104 converts the reflected light to an electrical signal which is thencarried by a signal wire in the interconnect bundle 205-1 back toprocessing housing 101. In some embodiments, Tachometer 209-1 determinesthe rate of rotation of shaft 202 according to the electrical signalprovided to Tachometer over interconnect bundle 205-1 via cable 105-1.In some embodiments, blocks 404 through 406 are performed at the sametime as blocks 401 through 403.

FIG. 5 illustrates flowchart 500 of a method performed by processingapparatus of processing housing 101, according to some embodiments ofthe disclosure. It is pointed out that those elements of FIG. 5 havingthe same reference numbers (or names) as the elements of any otherfigure can operate or function in any manner similar to that described,but are not limited to such.

Although the blocks in flowchart 500 with reference to FIG. 5 are shownin a particular order, the order of the actions can be modified. Thus,the illustrated embodiments can be performed in a different order, andsome actions/blocks may be performed in parallel. Some of the blocksand/or operations listed in FIG. 5 are optional in accordance withcertain embodiments. The numbering of the blocks presented is for thesake of clarity and is not intended to prescribe an order of operationsin which the various blocks must occur. Additionally, operations fromthe various flows may be utilized in a variety of combinations.

At block 501, Light Source 206-1 provides input light to first fiberoptic interconnect (or cable) 203-1 via cable 105-1 to deflection module103-1. In response to vibration in Vibrating Module 102-1, deflectionmodule 103-1 deflects the input light. The deflected input light isprovided to second fiber optic interconnect 204-1. At block 502, theoutput light from second fiber optic interconnect 204-1 is received byPhoto-Detector 207-1. At block 503, Photo Detector 207-1 converts theoutput light to an analog electrical signal. At block 504, the analogelectrical signal is converted to a digital representation by A2D 209.At block 505, Processing Module 107 processes the digital signal (whichmay be a stream of zeros and ones). As Processor Module 107 notices thechange in the digital pattern (i.e., the number of zeros and ones changedue to deflection), acceleration is determined. In embodiments that haveTachometer 209, at block 506, an electric signal is received byTachometer 208-1 from circuit 104.

While flowchart 500 shows block 506 after block 505, blocks 505 and 506are performed in parallel according to some embodiments. At block 507,Tachometer 209 determines the rate of rotation of shaft 202 according toa voltage level of the electric signal. In some embodiments, blocks 501through 505 are performed at the same time as blocks 506 through 507.

FIG. 6 illustrates a computer system or a SoC (System-on-Chip) withapparatus (e.g., Processing Module 107) to measure vibration of one ormore vibration modules and/or rotation rate of a shaft, according tosome embodiments. It is pointed out that those elements of FIG. 6 havingthe same reference numbers (or names) as the elements of any otherfigure can operate or function in any manner similar to that described,but are not limited to such.

In some embodiments, computing device 1600 includes a first processor1610 with apparatus to measure vibration of one or more vibrationmodules and/or rotation rate of a shaft, according to some embodimentsdiscussed. Other blocks of the computing device 1600 may also includethe apparatus to measure vibration of one or more vibration modulesand/or rotation rate of a shaft, according to some embodiments. Thevarious embodiments of the present disclosure may also comprise anetwork interface within 1670 (e.g., Comm. Interface 210) such as awireless interface so that a system embodiment may be incorporated intoa wireless device, for example, cell phone or personal digitalassistant.

In some embodiments, processor 1610 (and/or processor 1690) can includeone or more physical devices, such as microprocessors, applicationprocessors, microcontrollers, programmable logic devices, or otherprocessing means. The processing operations performed by processor 1610include the execution of an operating platform or operating system onwhich applications and/or device functions are executed. The processingoperations include operations related to I/O (input/output) with a humanuser or with other devices, operations related to power management,and/or operations related to connecting the computing device 1600 toanother device. The processing operations may also include operationsrelated to audio I/O and/or display I/O.

In some embodiments, computing device 1600 includes audio subsystem1620, which represents hardware (e.g., audio hardware and audiocircuits) and software (e.g., drivers, codecs) components associatedwith providing audio functions to the computing device. In someembodiments, audio subsystem 1620 is optional. Audio functions caninclude speaker and/or headphone output, as well as microphone input.Devices for such functions can be integrated into computing device 1600,or connected to the computing device 1600. In some embodiments, a userinteracts with the computing device 1600 by providing audio commandsthat are received and processed by processor 1610.

In some embodiments, computing device 1600 includes a Display subsystem1630. In some embodiments, Display subsystem 1630 is optional. Displaysubsystem 1630 represents hardware (e.g., display devices) and software(e.g., drivers) components that provide a visual and/or tactile displayfor a user to interact with the computing device 1600. Display subsystem1630 includes display interface 1632, which includes the particularscreen or hardware device used to provide a display to a user. In oneembodiment, display interface 1632 includes logic separate fromprocessor 1610 to perform at least some processing related to thedisplay. In one embodiment, display subsystem 1630 includes a touchscreen (or touch pad) device that provides both output and input to auser.

In some embodiments, computing device 1600 includes an I/O controller1640. In some embodiments, I/O controller 1640 is optional. I/Ocontroller 1640 represents hardware devices and software componentsrelated to interaction with a user. I/O controller 1640 is operable tomanage hardware that is part of audio subsystem 1620 and/or displaysubsystem 1630. Additionally, I/O controller 1640 illustrates aconnection point for additional devices that connect to computing device1600 through which a user might interact with the system. For example,devices that can be attached to the computing device 1600 might includemicrophone devices, speaker or stereo systems, video systems or otherdisplay devices, keyboard or keypad devices, or other I/O devices foruse with specific applications such as card readers or other devices.

As mentioned above, I/O controller 1640 can interact with audiosubsystem 1620 and/or display subsystem 1630. For example, input througha microphone or other audio device can provide input or commands for oneor more applications or functions of the computing device 1600.Additionally, audio output can be provided instead of, or in addition todisplay output. In another example, if display subsystem 1630 includes atouch screen, the display device also acts as an input device, which canbe at least partially managed by I/O controller 1640. There can also beadditional buttons or switches on the computing device 1600 to provideI/O functions managed by I/O controller 1640.

In some embodiments, I/O controller 1640 manages devices such asaccelerometers, cameras, light sensors or other environmental sensors,or other hardware that can be included in the computing device 1600. Theinput can be part of direct user interaction, as well as providingenvironmental input to the system to influence its operations (such asfiltering for noise, adjusting displays for brightness detection,applying a flash for a camera, or other features).

In some embodiments, computing device 1600 includes power management1650 that manages battery power usage, charging of the battery, andfeatures related to power saving operation. Memory subsystem 1660includes memory devices for storing information in computing device1600. Memory can include nonvolatile (state does not change if power tothe memory device is interrupted) and/or volatile (state isindeterminate if power to the memory device is interrupted) memorydevices. Memory subsystem 1660 can store application data, user data,music, photos, documents, or other data, as well as system data (whetherlong-term or temporary) related to the execution of the applications andfunctions of the computing device 1600.

Elements of embodiments are also provided as a machine-readable medium(e.g., memory 1660) for storing the computer-executable instructions(e.g., instructions to implement any other processes discussed herein).The machine-readable medium (e.g., memory 1660) may include, but is notlimited to, flash memory, optical disks, CD-ROMs, DVD ROMs, RAMs,EPROMs, EEPROMs, magnetic or optical cards, phase change memory (PCM),or other types of machine-readable media suitable for storing electronicor computer-executable instructions. For example, embodiments of thedisclosure may be downloaded as a computer program (e.g., BIOS) whichmay be transferred from a remote computer (e.g., a server) to arequesting computer (e.g., a client) by way of data signals via acommunication link (e.g., a modem or network connection).

In some embodiments, computing device 1600 comprises Connectivity 1670.In some embodiments, Connectivity 1670 includes hardware devices (e.g.,wireless and/or wired connectors and communication hardware) andsoftware components (e.g., drivers, protocol stacks) to enable thecomputing device 1600 to communicate with external devices. Thecomputing device 1600 could be separate devices, such as other computingdevices, wireless access points or base stations, as well as peripheralssuch as headsets, printers, or other devices.

Connectivity 1670 can include multiple different types of connectivity.To generalize, the computing device 1600 is illustrated with cellularconnectivity 1672, wireless connectivity 1674, and Ethernet connectivity1676. Cellular connectivity 1672 refers generally to cellular networkconnectivity provided by wireless carriers, such as provided via GSM(global system for mobile communications) or variations or derivatives,CDMA (code division multiple access) or variations or derivatives, TDM(time division multiplexing) or variations or derivatives, or othercellular service standards. Wireless connectivity (or wirelessinterface) 1674 refers to wireless connectivity that is not cellular,and can include personal area networks (such as Bluetooth, Near Field,etc.), local area networks (such as Wi-Fi), and/or wide area networks(such as WiMax), or other wireless communication. One implementation ofa connectivity is a Power-Over-Ethernet (PoE) style interface.

In some embodiments, computing device 1600 includes peripheralconnections 1680. Peripheral connections (or Sensor connections) 1680include hardware interfaces and connectors, as well as softwarecomponents (e.g., drivers, protocol stacks) to make peripheralconnections. It will be understood that the computing device 1600 couldbe a peripheral device (“to” 1682) to other computing devices, as wellas have peripheral devices (“from” 1684) connected to it. The computingdevice 1600 commonly has a “docking” connector to connect to othercomputing devices for purposes such as managing (e.g., downloadingand/or uploading, changing, synchronizing) content on computing device1600. Additionally, a docking connector can allow computing device 1600to connect to certain peripherals that allow the computing device 1600to control content output, for example, to audiovisual or other systems.

In addition to a proprietary docking connector or other proprietaryconnection hardware, the computing device 1600 can make peripheralconnections 1680 via common or standards-based connectors. Common typescan include a Universal Serial Bus (USB) connector (which can includeany of a number of different hardware interfaces), DisplayPort includingMiniDisplayPort (MDP), High Definition Multimedia Interface (HDMI),Firewire, or other types.

Reference in the specification to “an embodiment,” “one embodiment,”“some embodiments,” or “other embodiments” means that a particularfeature, structure, or characteristic described in connection with theembodiments is included in at least some embodiments, but notnecessarily all embodiments. The various appearances of “an embodiment,”“one embodiment,” or “some embodiments” are not necessarily allreferring to the same embodiments. If the specification states acomponent, feature, structure, or characteristic “may,” “might,” or“could” be included, that particular component, feature, structure, orcharacteristic is not required to be included. If the specification orclaim refers to “a” or “an” element, that does not mean there is onlyone of the elements. If the specification or claims refer to “anadditional” element, that does not preclude there being more than one ofthe additional element.

Furthermore, the particular features, structures, functions, orcharacteristics may be combined in any suitable manner in one or moreembodiments. For example, a first embodiment may be combined with asecond embodiment anywhere the particular features, structures,functions, or characteristics associated with the two embodiments arenot mutually exclusive.

While the disclosure has been described in conjunction with specificembodiments thereof, many alternatives, modifications and variations ofsuch embodiments will be apparent to those of ordinary skill in the artin light of the foregoing description. For example, other memoryarchitectures e.g., Dynamic RAM (DRAM) may use the embodimentsdiscussed. The embodiments of the disclosure are intended to embrace allsuch alternatives, modifications, and variations as to fall within thebroad scope of the appended claims.

In addition, well known power/ground connections to integrated circuit(IC) chips and other components may or may not be shown within thepresented figures, for simplicity of illustration and discussion, and soas not to obscure the disclosure. Further, arrangements may be shown inblock diagram form in order to avoid obscuring the disclosure, and alsoin view of the fact that specifics with respect to implementation ofsuch block diagram arrangements are highly dependent upon the platformwithin which the present disclosure is to be implemented (i.e., suchspecifics should be well within purview of one skilled in the art).Where specific details (e.g., circuits) are set forth in order todescribe example embodiments of the disclosure, it should be apparent toone skilled in the art that the disclosure can be practiced without, orwith variation of, these specific details. The description is thus to beregarded as illustrative instead of limiting.

The following examples pertain to further embodiments. Specifics in theexamples may be used anywhere in one or more embodiments. All optionalfeatures of the apparatus described here may also be implemented withrespect to a method or process.

For example, an apparatus is provided which comprises: an interface forreceiving a first fiber optic interconnect and a second fiber opticinterconnect; and a deflection module, coupled to the interface, thedeflection module to deflect an input light received from the firstfiber optic interconnect in response to a vibration or movement of theapparatus, and to provide the deflected input light as an output lightto the second fiber optic interconnect. In some embodiments, the firstfiber optic interconnect is coupled to a light source which generatesthe input light for the first fiber interconnect. In some embodiments,the second fiber optic interconnect is coupled to a photo detector toreceive the output light. In some embodiments, the output of the photodetector is received by an A2D converter. In some embodiments, the A2Dconverter to provide a digital output for a communication interface.

In some embodiments, the apparatus comprises: a shaft which is operableto rotate, the shaft having a reflective section; a light source toshine light on the shaft; and a photo detector to detect light reflectedoff the reflective section, wherein the interface receives a group ofinterconnects to provide power to the light source and to carry outputof the photo detector. In some embodiments, at least one interconnect ofthe group, which carries the output of the photo detector, is coupled toa tachometer which determines a rate of rotation of the shaft.

In another example, an apparatus is provided which comprises: aninterface for receiving a first fiber optic interconnect; and a lightsource, coupled to the interface, the light source to generate an inputlight for transmission to a deflection module via the first fiber opticinterconnect, the deflection module to deflect the input light receivedfrom the first fiber optic interconnect in response to a vibration ormovement of a housing having the deflection module. In some embodiments,the interface to receive a second fiber optic interconnect, and whereinthe apparatus further comprises: a photo detector, coupled to theinterface, the photo detector to receive an output light from thedeflection module via the second fiber optic interconnect.

In some embodiments, the apparatus further comprises an A2D converter toreceive an output from the photo detector and to generate a digitalrepresentation of the output. In some embodiments, the apparatus furthercomprises a communication interface for providing the output to anotherdevice. In some embodiments, the communication interface is capable toprovide the output as one or more of a Wi-Fi signal, Bluetooth signal, acellular signal, or as packets to an Ethernet cable. In someembodiments, the apparatus further comprises a tachometer to determine arate of rotation of a rotating shaft.

In another example, a system is provided which comprises: a cableincluding: a first fiber optic interconnect to provide an input light;and a second fiber optic interconnect to provide an output light; afirst housing coupled to the cable, the first housing including: a firstdeflection module to deflect the input light received from the firstfiber optic interconnect in response to a vibration or movement of thefirst housing; and a second housing coupled to the cable, the secondhousing including: a light source to generate the input light fortransmission to the first deflection module via the first fiber opticinterconnect; and a photo detector to receive the output light from thefirst deflection module via the second fiber optic interconnect.

In some embodiments, the first housing is integrated into a chassis of amotor. In some embodiments, the motor is coupled to a shaft which isoperable to rotate, the shaft having a reflective section, and whereinthe system comprises: a light source to shine light on the shaft; and aphoto detector to detect light reflected off the reflective section. Insome embodiments, a group of interconnects provide power to the lightsource and to carry an output of the photo detector. In someembodiments, the second housing includes a tachometer to receive theoutput of the photo detector of the first housing. In some embodiments,the cable houses the first and second fiber optic interconnects and thegroup of interconnects. In some embodiments, the second housing includesan A2D converter to receive an output from the photo detector and togenerate a digital representation of the output.

In some embodiments, the second housing includes a filter to filter thedigital representation of the output, and wherein the communicationinterface provides the filtered digital representation of the output toanother device. In some embodiments, the communication interface iscapable to provide the filtered digital representation of the output asone or more of a Wi-Fi signal, Bluetooth signal, a cellular signal, oras packets to an Ethernet cable. In some embodiments, the second housingincludes a PCB having the laser, photo detector, A2D converter, aprocessing element, and communication circuit positioned on the PCB.

In some embodiments, the first housing comprises: a second deflectionmodule to deflect the input light received from a third fiber opticinterconnect in response to a vibration or movement of the firsthousing, wherein the third optic fiber interconnect is part of thecable. In some embodiments, the cable includes a fourth fiber opticinterconnect to carry an output light from the second deflection module.In some embodiments, the second deflection module is orienteddifferently than an orientation of the first deflection module such thatthe first and second deflection modules allow for multi-axis measurementof the vibration or movement of the first housing.

In some embodiments, the system comprises a third housing separate fromthe first housing, wherein the third housing comprises: a thirddeflection module to deflect an input light received from a fifth fiberoptic interconnect in response to a vibration or movement of the thirdhousing. In some embodiments, the system comprises another cable whichincludes: the fifth fiber optic interconnect to provide the input lightto the third deflection module; and a sixth fiber optic interconnect toprovide an output light from the third deflection module. In someembodiments, the other cable is coupled to the second housing.

In another example, a method is provided which comprises: receiving afirst fiber optic interconnect and a second fiber optic interconnect;deflecting an input light received from the first fiber opticinterconnect in response to a vibration or movement of an apparatus; andproviding the deflected input light as an output light to the secondfiber optic interconnect. In some embodiments, the first fiber opticinterconnect is coupled to a light source which generates the inputlight for the first fiber interconnect. In some embodiments, the secondfiber optic interconnect is coupled to a photo detector to receive theoutput light. In some embodiments, the output of the photo detector isreceived by an A2D converter.

In some embodiments, the A2D converter to provide a digital output for acommunication interface. In some embodiments, the method furthercomprises: rotating a shaft, the shaft having a reflective section;shining a light on the shaft; and detecting light reflected off thereflective section. In some embodiments, the method comprises:converting the detected light to an output; and carrying the output to atachometer which determines a rate of rotation of the shaft.

In another example, an apparatus is provided which comprises: means forreceiving a first fiber optic interconnect and a second fiber opticinterconnect; means for deflecting an input light received from thefirst fiber optic interconnect in response to a vibration or movement ofan apparatus; and means for providing the deflected input light as anoutput light to the second fiber optic interconnect. In someembodiments, the first fiber optic interconnect is coupled to a lightsource which generates the input light for the first fiber interconnect.In some embodiments, the second fiber optic interconnect is coupled to aphoto detector to receive the output light.

In some embodiments, the output of the photo detector is received by anA2D converter. In some embodiments, the A2D converter to provide adigital output for a communication interface. In some embodiments, theapparatus further comprises: means for rotating a shaft, the shafthaving a reflective section; means for shining a light on the shaft; andmeans for detecting light reflected off the reflective section. In someembodiments, the apparatus comprises: means for converting the detectedlight to an output; and means for carrying the output to a tachometerwhich determines a rate of rotation of the shaft.

An abstract is provided that will allow the reader to ascertain thenature and gist of the technical disclosure. The abstract is submittedwith the understanding that it will not be used to limit the scope ormeaning of the claims. The following claims are hereby incorporated intothe detailed description, with each claim standing on its own as aseparate embodiment.

I claim:
 1. An apparatus comprising: an interface for receiving a first fiber optic interconnect and a second fiber optic interconnect, wherein the first and second fiber optic interconnects are to be housed in a cable along with power and ground lines; and a deflection module, coupled to the interface, wherein the deflection module is to deflect an input light received from the first fiber optic interconnect in response to a vibration or movement of an electric motor, and is to provide the deflected input light as an output light to the second fiber optic interconnect.
 2. The apparatus of claim 1, wherein the first fiber optic interconnect is coupled to a light source which generates the input light for the first fiber interconnect.
 3. The apparatus of claim 1, wherein the second fiber optic interconnect is coupled to a photo detector to receive the output light.
 4. The apparatus of claim 3, wherein the output of the photo detector is received by an Analog-to-Digital (A2D) converter.
 5. The apparatus of claim 4, wherein the A2D converter is to provide a digital output for a communication interface.
 6. The apparatus of claim 1, wherein the electric motor comprises: a shaft which is operable to rotate, the shaft having a reflective section, and wherein the apparatus further comprises: a light source to shine light on the shaft; and a photo detector to detect light reflected off the reflective section, wherein the interface receives a group of interconnects to provide power to the light source and to carry output of the photo detector.
 7. The apparatus of claim 6, wherein at least one interconnect of the group, which carries the output of the photo detector, is coupled to a tachometer which determines a rate of rotation of the shaft.
 8. An apparatus comprising: an interface for receiving first and second fiber optic interconnects, wherein the first and second fiber optic interconnects are to be housed in a cable along with power and ground lines; and a light source, coupled to the interface, the light source to generate an input light for transmission to a deflection module via the first fiber optic interconnect, wherein the deflection module is to deflect the input light received from the first fiber optic interconnect in response to a vibration or movement of a housing having the deflection module and an electric motor.
 9. The apparatus of claim 8, wherein the interface is to receive a second fiber optic interconnect, and wherein the apparatus further comprises: a photo detector, coupled to the interface, wherein the photo detector is to receive an output light from the deflection module via the second fiber optic interconnect.
 10. The apparatus of claim 9 further comprises an analog-to-digital (A2D) converter to receive an output from the photo detector and to generate a digital representation of the output.
 11. The apparatus of claim 10 further comprises a communication interface for providing the output to another device.
 12. The apparatus of claim 11, wherein the communication interface is capable to provide the output as one or more of a Wi-Fi signal, Bluetooth signal, a cellular signal, or as packets to an Ethernet cable.
 13. The apparatus of claim 9 further comprises a tachometer to determine a rate of rotation of a rotating shaft.
 14. A system comprising: a cable including: a first fiber optic interconnect to provide an input light; and a second fiber optic interconnect to provide an output light; a first housing coupled to the cable, the first housing including: a first deflection module to deflect the input light received from the first fiber optic interconnect in response to a vibration or movement of the first housing, wherein the first housing is integrated into a chassis of an electric motor; and a second housing coupled to the cable, the second housing including: a light source to generate the input light for transmission to the first deflection module via the first fiber optic interconnect; and a photo detector to receive the output light from the first deflection module via the second fiber optic interconnect.
 15. The system of claim 14, wherein the electric motor is coupled to a shaft which is operable to rotate, the shaft having a reflective section, and wherein the system comprises: a light source to shine light on the shaft; and a photo detector to detect light reflected off the reflective section.
 16. The system of claim 15, wherein a group of interconnects is to provide power to the light source and to carry an output of the photo detector.
 17. The system of claim 16, wherein the second housing includes a tachometer to receive the output of the photo detector of the first housing.
 18. The system of claim 15, wherein the cable houses the first and second fiber optic interconnects and the group of interconnects.
 19. The system of claim 18, wherein the second housing includes a filter to filter the digital representation of the output, and wherein the communication interface provides the filtered digital representation of the output to another device.
 20. The system of claim 19, wherein the communication interface is capable to provide the filtered digital representation of the output as one or more of a Wi-Fi signal, Bluetooth signal, a cellular signal, or as packets to an Ethernet cable.
 21. The system of claim 14, wherein the second housing includes an analog-to-digital (A2D) converter to receive an output from the photo detector and to generate a digital representation of the output.
 22. The system of claim 21, wherein the second housing includes a printed circuit board (PCB) having the laser, photo detector, A2D converter, a processing element, and communication circuit positioned on the PCB.
 23. The system of claim 14, wherein the first housing comprises: a second deflection module to deflect the input light received from a third fiber optic interconnect in response to a vibration or movement of the first housing, wherein the third optic fiber interconnect is part of the cable.
 24. The system of claim 23, wherein the cable includes a fourth fiber optic interconnect to carry an output light from the second deflection module. 